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URL Link: http://www.intel.com/technology/framework/spec.htm& v* v. U5 H6 p% x# ^
The Intel® Platform Innovation Framework for EFI Architecture Specification describes the primary design elements of an innovative approach to constructing platform firmware for platforms based on Intel® architecture. The design is characterized by a central “framework” that provides services and infrastructure to combine modular software building block elements. Taken together, the infrastructure code—which is known as the Foundations—and an appropriate selection of modular building blocks constitute a complete platform software implementation that is designed to initialize the platform and boot shrink-wrap operating systems or other custom application environments. The Foundations are comprised of the Pre-EFI Initialization (PEI) and Driver Execution Environment (DXE) phases, which are both described in this specification. In addition, this specification describes a number of other design elements in an effort to provide a complete set of baseline design and services support for arbitrary building blocks that will customize a particular platform firmware image to the hardware and the intended purpose and market for that hardware. These additional elements include such things as security services, boot device policy management, runtime services, afterlife, firmware storage, user interface, firmware integrity services, manageability support, legacy compatibility and boot/resume paths.
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# m4 m3 ?/ n/ @9 K$ D+ m4 ~Interoperability and Component Specifications ( J( j/ y' q3 n. C; i
( j/ V0 o3 X4 z- J! m2 c/ iThese additional specifications describe in greater depth the functional components that complement the PEI and DXE Foundations and that are also architectural in the Framework design. "Architectural" in this context implies that the functional components provide services that may always be assumed to be present by any code designed and written to operate across a range of platforms that use firmware based on the Framework design.
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All specifications are available as PDF files2 p( N% l7 [2 ?
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Zip file containing all PDF files (ZIP 11MB)
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Intel® Platform Innovation Framework for EFI Architecture Specification (PDF 893KB) W4 Q( u- _6 C t4 r
ACPI Specification v0.90 (PDF 212KB) . P- C( N) @8 w( Z3 F5 d
ACPI Specification v0.91 (PDF 246KB)
( Y' ]6 }) r8 kACPI Table Storage Specification v0.90 (PDF 139KB)
" T& V- W! w: D8 ]ACPI Table Storage Specification v0.91 (PDF 190KB) ! }9 H; ?6 K2 u
Boot Script Specification v0.9 (PDF 200KB)
) J$ `3 U& F& S; [& PBoot Script Specification v0.91 (PDF 275KB)
* o1 I7 f$ [$ ^. rCache Subclass Specification (PDF 224KB) ' n4 A% E& u1 r
Capsule Specification (PDF 270KB)
! Q C* B! |. x6 cCompatibility Support Module Specification v0.96 (PDF 547KB) $ h5 G3 G1 W8 H0 f
Compatibility Support Module Specification v0.97 (PDF 576KB)
5 e+ ~7 r& Y: {- X1 hCPU I/O Protocol Specification (PDF 205KB) 2 G& m4 p- O/ B* b* K
Data Hub Specification (PDF 177KB)
! L# J4 S6 A$ J! Z6 h; v- }* o) a3 pData Hub Subclass Design Guide (PDF 156KB) $ I& {! F# i9 q/ q, {; p
Driver Execution Environment Core Interface Specification (DXE CIS)** v0.9 (PDF 1.05MB) ; n1 x' b7 L F( b, T# C4 ?
Driver Execution Environment Core Interface Specification (DXE CIS)** v0.91 (PDF 1.07MB)
. e) |: U( f v. y5 T; lFirmware File System Specification (PDF 237KB) : G' f" g& h2 K
Firmware Volume Block Specification (PDF 197KB) / K; r& U3 _/ V7 f' |
Firmware Volume Specification (PDF 403KB)
3 t: x" x% f" ?( E/ HHand-Off Block (HOB) Specification (PDF 231KB) 2 V/ A5 \, s$ e! e
Hot-Plug PCI Initialization Protocol Specification (PDF 108KB) $ x6 \1 o; s, \6 h
Human Interface Infrastructure Specification v0.9 (PDF 597KB)
0 L5 K% E( X5 m$ a2 \2 r5 RHuman Interface Infrastructure Specification v0.91 (PDF 800KB)
$ g, ]. `0 D* B; gHuman Interface Infrastructure Specification v0.92 (PDF 764KB)
+ j9 Z2 p; L p! K* qIDE Controller Initialization Protocol Specification (PDF 139KB) 7 E3 T8 L4 ]4 z7 t7 w$ ]0 _$ P
Memory Subclass Specification (PDF 397KB) * R; g1 `$ V; r' o$ @
Miscellaneous Subclass Specification (PDF 490KB) u$ `6 e$ J2 q9 f0 x+ E
PCI Host Bridge Resource Allocation Protocol Specification (PDF 212KB)
P' O% [' S" R1 m9 GPCI Platform Support Specification (PDF 115KB) # l9 N$ O5 \- H( h5 y6 A
Platform IDE Initialization Protocol Specification (PDF 83KB)
# J5 F& S5 C6 g9 q$ A, f1 | {Pre-EFI Initialization Core Interface Specification (PEI CIS)** v0.9 (PDF 881KB) ) X: P# l- h$ N6 ?
Pre-EFI Initialization Core Interface Specification (PEI CIS)** v0.91 (PDF 841KB)
5 h' k- p: |4 N: h3 H) uProcessor Subclass Specification (PDF 314KB)
b" ^: x/ A& R/ F) Y; ZRecovery Specification (PDF 225KB)
* e2 b- E' X2 NS3 Resume Boot Path Specification (PDF 173KB) " m6 k; v# b8 Q" S
SMBus Host Controller Protocol Specification (PDF 198KB) ' A+ z) H4 F8 p
SMBus PPI Specification (PDF 188KB)
$ L4 @% s( f/ K) X/ H( WStatus Codes Specification v0.9 (PDF 682KB)
/ ~- m J1 q+ d" cStatus Codes Specification v0.92 (PDF 523KB)
1 v1 D. h: X* V) L8 l' d( uSystem Management Mode Core Interface Specification (SMM CIS) v0.9 (PDF 713KB) - v; m) w- A+ Q! z
System Management Mode Core Interface Specification (SMM CIS) v0.91 (PDF 646KB) |
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